MANUFACTURING CAPABILITIES
Engineer-to-Engineer
Micro-Con has forged a reputation of building synergistic relationships with all of our customers over the past 10 years. We begin one-on-one,
engineer-to-engineer using a proven systematic design process, along with a comprehensive suite of products that provide the utmost in quality, performance
and value.
Proven Systematic Design Process
Micro-Con’s proven systematic design process is a thoroughly documented procedure monitored and controlled by Conceptual Design Reviews (COR), Preliminary
Design Reviews (PDR), Critical Design Reviews (CDR) and Production Readiness Reviews (PRR).
View some of the complex designs we have developed:
Multifunction Modules Frequency Converters Switch Filters Broadband Amplifiers
Learn more about our build-to-print services
Services
ASSEMBLY
At Micro-Con, 100% of our assembly operations are performed in our fully equipped, state-of-the-art Class 10,000 microelectronics clean room. All assembly,
regardless of application (space, military, or commercial) is performed in this strictly monitored clean room environment. Our in-house manufacturing
capabilities include:
•Plasma Cleaning
•Epoxy Die Attach
•Eutectic Die Attach
•Wire Bond (Ball & Wedge)
•Surface Mount Solder Assembly
•Parallel Gap Welding
•Laser Etching & Marking
•Vacuum Bake
•Hermetic Seam Sealing
•Hermetic Package De-lidding
•Controlled Vacuum Lamination
•Epoxy Die Attach
•Eutectic Die Attach
•Wire Bond (Ball & Wedge)
•Surface Mount Solder Assembly
•Parallel Gap Welding
•Laser Etching & Marking
•Vacuum Bake
•Hermetic Seam Sealing
•Hermetic Package De-lidding
•Controlled Vacuum Lamination
TESTING/SCREENING/INSPECTION
Micro-Con’s Electrical and Environmental Test labs are also fully contained within our class 10,000 clean room. In addition to fully automated electrical
test, Micro-Con offers complete in-house environmental screening in accordance with MIL-PRF-38534.
Our In-house testing/screening/inspection capabilities include:
•High Power (up to 400X) Video Inspection & Documentation System
•Dedicated ATE (10 Fully Automated Test Racks)
•State-of-the-Art Phase Noise Test Station
•Residual Phase Noise for Amplifiers
•Absolute Phase Noise for Signal Sources
•Fine & Gross Leak Test IAW MIL-STD-883, Method 1014
•Constant Acceleration IAW MIL-STD-883, Method 2001.2
•Thermal Shock IAW MIL-STD-883, Method 1011
•Bond Pull Test IAW MIL-STD-883, Methods 2011 & 2023
•Dedicated ATE (10 Fully Automated Test Racks)
•State-of-the-Art Phase Noise Test Station
•Residual Phase Noise for Amplifiers
•Absolute Phase Noise for Signal Sources
•Fine & Gross Leak Test IAW MIL-STD-883, Method 1014
•Constant Acceleration IAW MIL-STD-883, Method 2001.2
•Thermal Shock IAW MIL-STD-883, Method 1011
•Bond Pull Test IAW MIL-STD-883, Methods 2011 & 2023