ENGINEERING CAPABILITIES
Engineer-to-Engineer
Micro-Con has forged a reputation of building synergistic relationships with all of our customers over the past 10 years. We begin one-on-one,
engineer-to-engineer using a proven systematic design process, along with a comprehensive suite of products that provide the utmost in quality, performance
and value.
Proven Systematic Design Process
Micro-Con’s proven systematic design process is a thoroughly documented procedure monitored and controlled by Conceptual Design Reviews (COR), Preliminary
Design Reviews (PDR), Critical Design Reviews (CDR) and Production Readiness Reviews (PRR).
View some of the complex designs we have developed:
Multifunction Modules Frequency Converters Switch Filters Broadband Amplifiers
Learn more about our build-to-print services
Services
DESIGN/CONSULTING
Micro-Con’s engineering staff has a vast amount of experience designing complex, broadband RF & microwave devices for high reliability applications. Our
experience includes a wide variety of MMIC devices, complex multi-function modules, as well as complete RF subsystems for applications such as airborne EW. This experience, along with our comprehensive suite of CAD tools, enables us to offer a complete array of design and consulting services.
In addition to the traditional materials and technologies used in MIC components and sub-assemblies, our staff possesses extensive design experience using
advanced technologies. Highly integrated RFIC/MMIC devices, multilayer Low Temperature Co-fired Ceramic (LTCC) substrates and housings fabricated from the
latest lightweight composite materials such as AlSiC are just a few examples.
Our In-house design/consulting services include:
•High Reliability Multifunction Modules
•Custom MMIC Design
•Custom LTCC Design
•Custom MMIC Design
•Custom LTCC Design
Our Suite of CAD Tools includes the following:
•Linear & Non-Linear Circuit Simulation (MW Office)
•2.5D Electromagnetic Simulation (MW Office)
•Full 3D Electromagnetic Simulation (HFSS)
•PCB Design &Layout (ORCAD)
•Mechanical Design & Layout (AutoCAD)
•Solid Modeling (Solidworks)
•Thermal Analysis (Harvard Thermal TAS)
•Reliability Analysis & MTBF Prediction (RELEX)
•2.5D Electromagnetic Simulation (MW Office)
•Full 3D Electromagnetic Simulation (HFSS)
•PCB Design &Layout (ORCAD)
•Mechanical Design & Layout (AutoCAD)
•Solid Modeling (Solidworks)
•Thermal Analysis (Harvard Thermal TAS)
•Reliability Analysis & MTBF Prediction (RELEX)